{
  "annotation_id": "a4796038-eb3d-4690-bfd3-183ec01e4576",
  "date_created": "2026-03-02T18:00:47.004000Z",
  "date_modified": "2026-03-02T18:00:47.004000Z",
  "file_hash": "80708303b6d771868812b75574c862145b2c4554fc303943bfded3ef093c4232",
  "private": false,
  "record": {
    "abstract": "Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump\nbonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to\nsingle chip pixel detectors have been successfully built and operated. The MPEC\n2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of\n18 bit, 2 counters and energy windowing with continuously adjustable\nthresholds. Each MPEC has 32 x 32 pixels of 200 um x 200 um pixel size. For a\nMCM the 4 chips are arranged in a 2 x 2 array which leads to a 64 x 64 sensor\npixel geometry. The MCM construction is described, and the imaging performance\nof the different detectors is shown. As readout system a newly developed USB\nsystem has been used.",
    "arxiv_id": "physics/0312070",
    "authors": [
      "Peter Fischer",
      "Sven Krimmel",
      "Hans Krueger",
      "Markus Lindner",
      "Mario Loecker",
      "Kazuhiro Nakazawa",
      "Tadayuki Takahashi",
      "Norbert Wermes"
    ],
    "categories": [
      "physics.ins-det"
    ],
    "doi": "10.1109/TNS.2004.832610",
    "journal_ref": "IEEE Trans. Nucl. Sci., vol. 51, no. 4, pp. 1717-1723, Aug. 2004",
    "title": "Single Photon Counting X-ray Imaging with Si and CdTe Single Chip Pixel   Detectors and Multichip Pixel Modules",
    "url": "https://arxiv.org/abs/physics/0312070"
  },
  "schema_id": "dorsal/arxiv",
  "source": {
    "execution_id": "9f61d196-e9d4-47a2-ad33-3e87b42dc7df",
    "id": "arXiv Dataset IDs",
    "type": "Model",
    "variant": "snapshot-2026-03-01",
    "version": "0.1.0"
  },
  "user_id": 1000002
}