{
  "annotation_id": "5d01f536-1bb5-4f08-aa05-aa0bd4f730dd",
  "date_created": "2026-03-02T18:00:50.133000Z",
  "date_modified": "2026-03-02T18:00:50.133000Z",
  "file_hash": "ce664d557afff5c79a8dfe54ecd8fc5b5f257f27e43fc6924be7bcfe079cdd97",
  "private": false,
  "record": {
    "abstract": "For the ATLAS Pixel Detector fast readout electronics has been successfully\ndeveloped and tested. Main attention was given to the ability to detect small\ncharges in the order of 5,000 electrons within 25 ns in the harsh radiation\nenvironment of LHC together with the challenge to cope with the huge amount of\ndata generated by the 80 millions channels of the Pixel detector. For the\nintegration of the 50 micron pitch hybrid pixel detector reliable bump bonding\ntechniques using either lead-tin or indium bumps has been developed and has\nbeen successfully tested for large scale production.",
    "arxiv_id": "physics/0401106",
    "authors": [
      "Fabian Huegging"
    ],
    "categories": [
      "physics.ins-det"
    ],
    "doi": "10.1016/j.nima.2005.04.045",
    "journal_ref": "Nucl.Instrum.Meth.A549:157-164,2005",
    "title": "Front-End electronics and integration of ATLAS pixel modules",
    "url": "https://arxiv.org/abs/physics/0401106"
  },
  "schema_id": "dorsal/arxiv",
  "source": {
    "execution_id": "4e273670-cdde-4756-b35d-6f854fd67642",
    "id": "arXiv Dataset IDs",
    "type": "Model",
    "variant": "snapshot-2026-03-01",
    "version": "0.1.0"
  },
  "user_id": 1000002
}